The AI heat wave is coming
Adoption of accelerated IT and high-performance computing (HPC) architectures is growing at a fast pace to meet the demands of AI workloads.
Power consumption and heat generation from AI chips are orders of magnitude higher than conventional IT equipment. Power and cooling infrastructure designs are being transformed as traditional cooling technologies might not measure up to the needs of AI workloads.
Don’t let your infrastructure slow down your AI deployments or throttle your AI workloads. Vertiv can help you rethink your critical infrastructure in the age of AI.
Vertiv solutions are AI-ready
Vertiv offers cutting-edge solutions engineered with industry leaders in the AI industry to power and cool even the highest density workloads in most challenging deployments.
Vertiv is working together with leaders in the AI industry
Adding Vertiv expertise to the NVIDIA Partner Network
Vertiv and NVIDIA collaborated to develop a unique AI cooling solution for the COOLERCHIPS program and formalized our partnership when Vertiv joined the NVIDIA Partner Network. NVIDIA’s cutting-edge platforms need advanced infrastructure solutions. AI deployments can count on Vertiv’s leadership in power and cooling to keep their AI running no matter the cluster size.
Supporting Intel’s latest generation AI accelerator
Vertiv is collaborating with Intel to provide liquid- and air-cooled solutions for the revolutionary Gaudi3 AI accelerator. Our liquid cooled solution has been tested at 160kW accelerator power using facility water from 17°C to 45°C (62.6°F to 113°F). The air-cooled solution has been tested up to 40kW of heat load that can be deployed in warm ambient air data centers up to 35°C (95°F).
Unleashing the power for accelerated IT
Vertiv leadership in mission-critical power infrastructure from grid to chip enables us to fully address key customer challenges
Our modular compact-footprint offer can scale up to power needs of the most demanding AI workloads. We have the power solutions that can keep critical inferencing loads running in case of outages. And our advanced battery-energy storage systems (BESS) can help data centers build the micro-grid to reduce dependency of utility providers.
From switchgears to rack power distribution units (PDUs), our unmatched portfolio in power management encompasses solutions to keep your workloads up even when the grid is down.
Choose your path to high-density
Your journey to high-density can be a smooth ride. No matter its starting point or final destination
Direct-to-Chip
Cold plates sit atop the heat-generating components (usually chips such as CPUs and GPUs) to draw off heat. Fluid flows through manifolds and in pipes through IT equipment, exchanging heat with cold plates to draw off heat without touching the chips. Air cooling is still required to extract heat from components that do not have a cold plate.
Rear door heat exchanger
Passive or active heat exchangers replace the rear door of the IT rack. Fluid goes through heat exchanging coils in the back of the rack absorbing heat in the air carried by the fans of IT equipment (hence why often called "air-to-liquid"). These are often used in combination with direct-to-chip as a strategy to keep room neutrality, or a transitional design enabling an easy conversion into direct-to-chip in the future.
Immersion Cooling
Servers and other IT equipment are submerged in a tank filled with thermally conductive but dielectric (electric non-conductive) fluid. There is no need of air cooling as equipment is the tank. This approach maximizes the thermal transfer properties of liquid and is often the most energy-efficient form of liquid cooling on the market.
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Make your transition to AI-ready hassle-free
Turnkey service including site assessment, modelling and solution design by Vertiv™ power and thermal experts to easily upgrade your existing infrastructure to AI-ready.
Thorough site visits carried out by our specialist team of engineers map site and availability of infrastructure to support defining optimal layout and system design. Integration drawings and computational fluid dynamic (CFD) digital twin modelling guarantee any operator’s piece of mind for later site expansion or maintenance.
Meet our unmatched deployment expertise
AI starter kits
Easy-to-transition homologated designs covering multiple technology options. Our AI Starter Kits are built to meet the requirements of a wide range of applications and are adaptable to different existing available infrastructures.
Pre-fabricated modular solution
Pre-fabricated modular solution offering from a single rack, to entire data center enabling scaling up sites at speed.
Only Vertiv can meet the power and cooling needs of your AI workloads
Vertiv has the technological expertise, portfolio breadth, services capabilities, operational footprint and industry partnerships to power and cool your HPC deployments.
Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.
Technical partnerships with chipmakers leading the AI revolution.
End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.
Services coverage with unmatched global reach and AI-ready capability.
Resilient manufacturing footprint able to scale up new technologies globally.
Unique pre-fabricated modular offering from single rack to entire data center.
Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.
Technical partnerships with chipmakers leading the AI revolution.
End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.
Services coverage with unmatched global reach and AI-ready capability.
Resilient manufacturing footprint able to scale up new technologies globally.
Unique pre-fabricated modular offering from single rack to entire data center.
Vertiv solutions are AI-ready
Vertiv offers cutting-edge solutions engineered with industry leaders in the AI industry to power and cool even the highest density workloads in most challenging deployments.
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