Liebert® XDU1350 Coolant Distribution Unit
The Vertiv™ Liebert® XDU1350 Coolant Distribution Unit is designed to support liquid cooling within high density environments. It is suitable for chip and rear door cooling applications. It offers easy, cost-effective deployment in any data center. It uses a liquid-to-liquid heat exchange method to efficiently support higher rack densities while maintaining optimal system conditions.
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- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Liebert® XDU1350 Coolant Distribution Unit
The Vertiv™ Liebert® XDU1350 Coolant Distribution Unit is designed to support liquid cooling within high density environments. It is suitable for chip and rear door cooling applications. It offers easy, cost-effective deployment in any data center. It uses a liquid-to-liquid heat exchange method to efficiently support higher rack densities while maintaining optimal system conditions.
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Benefits

- HIGHER EFFICIENCY & RELIABILITY: Achieve greater efficiency and benefit from redundancy options for high-density environments.
- PROTECTS SECONDARY LIQUID NETWORK: Ensures strict conformance to wetted material compatibility.
- EASY DEPLOYMENT: Intuitively designed for easy deployment.
- FLEXIBLE DESIGN: Accommodates any facility layout and offers multiple cooling configurations.
- PACKED FEATURES: Integrated controller designed from the ground up to be easy to deploy and supports leak detection.
- READY SUPPORT: Industry-leading service support with local installation and same-day maintenance.
Features

- COMPACT FOOTPRINT: Allows for in-row deployments.
- INTEGRATED 50 MICRON FILTER: Keeps supply water contaminant-free to protect server integrity and performance.
- PRECISE TEMPERATURE CONTROL: Eliminates thermal shock for server CPUs and GPUs.
- INTELLIGENT FLOW MONITORING WITH ALARM FEATURES: Helps maintain system performance and efficiency.
- EASILY ACCESSIBLE FILL PORT & DRAIN LOCATIONS: Streamlines and simplifies maintenance.
- INNOVATIVE STAINLESS-STEEL DESIGN & HYGIENIC COUPLINGS: Helps ensure Secondary Fluid Network integrity.
Specifications
Seamlessly transition to high-efficiency liquid cooling technology with Vertiv™ CoolChip CDU (next generation of Vertiv™ Liebert® XDU family). From hyperscale and colocation environments to edge applications, the Vertiv CoolChip CDU offers flexible deployments for rear door heat exchangers or direct contact liquid cooling. It allows for in-rack, end of row, or perimeter placement options. Easily distribute coolant to efficiently manage power dense deployments with liquid-to-liquid heat exchange up to 100 kW, 450 kW, 600 kW, or 1,350 kW, and liquid-to-air heat exchange up to 70kW. With precise temperature control, this unit can eliminate thermal shock. Have reliable operations with its redundant pumps and dual power feeds and added peace of mind with remote monitoring and communications.
- Product Specifications
- Net Sensible Nominal Capacity kBtuh[kW]*
- 1368 kW at 7.2°F (4°C)
- Nominal Airflow Data Center Air (CFM, m3/h)
- N/A
- Net Sensible Nominal Capacity kBtuh[kW]*
- 1368 kW at 7.2 F (4 C): Secondary Circuit flow rate at 320 GPM (1200 l/m) at 35.4 psi ( 2.44 bar) external ΔP
- Input Voltage (V/Phase/Frequency Hz)
- 480 V, 3PH, 60Hz
- Controls and Monitoring
- Color touch screen display
- Agency Approvals
- CE, cULus, RoHS
- Key Components
- Redundant pump design with variable-speed pump controls
- Physical Characteristics
- Weight
- 1431 lbs
- Weight
- 1509 kgs
- Height
- 684 in
- Height
- 2070 mm
- Width
- 35.4 in
- Width
- 900 mm
- Depth
- 48.9 in
- Depth
- 1242 mm
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.