Vertiv™ MegaMod™ CoolChip: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ CoolChip is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape— the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing. It delivers prefabricated and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, the Vertiv MegaMod CoolChip is designed to support the most demanding compute environments. Combining direct-to-chip liquid cooling with flexible air-cooled architectures, it effectively manages the intense heat loads generated by AI and HPC applications and provides optimal performance and reliability. It supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
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Vertiv™ MegaMod™ CoolChip: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ CoolChip is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape— the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing. It delivers prefabricated and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, the Vertiv MegaMod CoolChip is designed to support the most demanding compute environments. Combining direct-to-chip liquid cooling with flexible air-cooled architectures, it effectively manages the intense heat loads generated by AI and HPC applications and provides optimal performance and reliability. It supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
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