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Vertiv and the Open Compute Project (OCP)

Vertiv and the Open Compute Project (OCP)

The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software.

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: OCP Global Summit; 2023/10/17 00:00; 2023/10/19 11:00
: ottobre 17 - ottobre 19, 2023
: Booth A5 - 10x10 Sapphire & Demo Area showcasing the XR App, San Jose Convention Center, San Jose, CA,

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Vertiv Participation

Vertiv has been an active contributor to several OCP projects, most recently co-authoring a paper on design guidelines for immersion-cooled IT equipment. That work is consistent with our leadership position in data center thermal management and recognizes the challenges presented by continued increases in compute density. We collaborated with other OCP-affiliated experts in thermal management, fluid materials science and engineering, server integration, and power connectivity to identify guidelines and best practices in immersion cooling for high-density environments. Vertiv also developed rack DC bus bars and a 12V DC power shelf that are compatible with OCP racks.

Vertiv is active in the OCP today, serving on multiple committees including Data Center Facility, Rack and Power, and Advanced Cooling Facilities – Incubation. We are collaborating with other industry thought leaders on power and cooling innovations for future OCP racks to continue to drive data center efficiency.

Vertiv and OCP

Vertiv has been a powerful voice in the Open Compute Project, contributing to product development, serving on multiple OCP committees, co-authoring several papers, and presenting on various topics at Open Compute events.

Direct-OCP products:

OCPv3 Rack – available on ETO, currently in process for making a more standard ordering.
DC Power Shelf – In Development. DC Power intel from June was nothing currently available for ordering for OCP.
OCP in-rack manifold – on roadmap for potential development
OCP Adapter for DCD – on roadmap

Indirect OCP products:

Rear door heat exchanger DCD
rPDUs – available, for some use cases where there is still need for AC powered equipment in the rack
XDU product offerings
XDU600 (liquid-to-liquid CDU) - roadmap
XDU100 (liquid-to-liquid CDU) - roadmap
XDM300 (split chiller) - roadmap
XDU450 & 1350 (liquid-to-liquid CDU)
XDM200 & 400 (split chiller)
XDU070 (liquid-to-air CDU)

We have coverage in the projects including:

Rack and Power (Nick Fontana and Mike Smith)

Hardware Management (Mick Jones)

Cooling Environments (Benny Bray and John Menoche)

OCP Immersion Requirements Rev.2.0

Design Guidelines for Immersion-Cooled IT Equipment

Leak Detection and Intervention

Liquid Cooling Integration and Logistics

Immersion Requirements

OCP Tech Talk Series: Cooling Environments

Achieving Data Center Simplicity and Standardization with Universal Rack PDU

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Vertiv and the Open Compute Project (OCP)

Vertiv Participation

Vertiv and OCP

Direct-OCP products:

Indirect OCP products:

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