Vertiv at TechNet Indo-Pacific 2026
Join Vertiv at TechNet Indo-Pacific 2026 to explore power, cooling, and IT infrastructure solutions for mission-critical Indo-Pacific and Federal environments. Visit Booth #605 to see Great Lakes products integrated with Vertiv technologies, including seismic-rated cabinets, UPS systems, and infrastructure designed for edge, AI, and distributed mission applications
Join Vertiv at TechNet Indo-Pacific 2026 to explore power, cooling, and IT infrastructure solutions for mission-critical Indo-Pacific and Federal environments. Visit Booth #605 to see Great Lakes products integrated with Vertiv technologies, including seismic-rated cabinets, UPS systems, and infrastructure designed for edge, AI, and distributed mission applications.
Modular infrastructure approaches for Indo-Pacific mission requirements
Learn how Vertiv technologies are applied in mission-critical environments with remote, space-constrained, and evolving operational requirements. Discuss modular power, cooling, IT infrastructure, and deployment approaches for Indo-Pacific applications.
Featured technologies on display at Booth #605
See the Great Lakes EZ Cabinet (seismic-rated), Vertiv™ Liebert® GXT5 TAA UPS, and Vertiv™ APM2 UPS. Discuss infrastructure approaches that support mission-critical operations, edge deployments, and Federal application requirements.
Why meet with Vertiv?
Mission focus:
Discuss infrastructure approaches aligned with mission-critical Federal environments.
AI readiness:
Explore liquid cooling and AI infrastructure considerations and view cabinet and UPS technologies at the event.
Direct engagement:
Meet with Vertiv and Great Lakes representatives to discuss infrastructure requirements and deployment considerations.
Connect with us at Booth #605
Meet with the Vertiv and Great Lakes teams at Booth #605 to discuss Federal infrastructure requirements, AI-ready deployment considerations, seismic-rated cabinet technologies, UPS solutions, and mission-critical projects across the Indo-Pacific region.
