Vertiv™ CoolChip CDU 2300 and Vertiv™ CoolChip Fluid Network Row Manifolds to be showcased at Datacloud Global Congress
LONDON, UK [May 26, 2026] – Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced the expansion of its end-to-end thermal chain with the availability of the Vertiv™ CoolChip CDU 2300 and Vertiv™ CoolChip Fluid Network Row Manifolds in Europe, Middle East and Africa (EMEA). These liquid cooling technologies support the growing demands of AI and high-density, next-generation compute to help customers deploy high-density infrastructure faster and operate more efficiently.
The Vertiv CoolChip family is a core building block of the Vertiv thermal chain, an end-to-end portfolio including direct-to-chip cooling, immersion cooling, rear-door heat exchangers, coolant distribution, heat rejection, intelligent controls, and lifecycle services into a single, cohesive thermal management system.
The newly announced solutions will be on display at Datacloud Global Congress in Cannes (June 1 - 4), where Vertiv will participate as a Patron Sponsor and showcase its latest technologies at booth #123.
“The rapid growth of AI workloads is driving a fundamental shift in how data centres are designed, cooled, powered and operated,” said Paul Ryan, president for EMEA at Vertiv. “At Datacloud Global Congress, we’re showing how Vertiv is expanding its end to end portfolio, combining high-density power solutions, liquid cooling, heat rejection, intelligent controls, and lifecycle services, to help customers deploy AI-ready infrastructure faster and operate more efficiently over time.”
As a critical link in the Vertiv™ thermal chain, the Vertiv CoolChip CDU 2300 is a liquid-to-liquid coolant distribution unit delivering 2.3 MW of cooling capacity in a compact footprint, offering one of the highest capacity-to-footprint ratios available in the market. Its smaller cabinet supports flexible placement, including in row or in adjacent mechanical areas, helping operators reduce floor space requirements and the number of CDUs needed in large scale, high density deployments.
Vertiv™ CoolChip CDU systems span from 100 kW to 2.3 MW and support direct to chip liquid cooling as well as rear door heat exchangers. The integrated Vertiv™ CoolChip CDU controller allows temperature and flow to adapt to workload demands, while features such as redundancy, unit to unit communication, and remote monitoring help enhance system availability and simplify operations. This controller-level intelligence enables the CDU to operate in coordination with other elements of the thermal chain, enabling consistent thermal performance across the entire infrastructure.
Complementing the CDU within the thermal chain architecture, the new Vertiv™ CoolChip Fluid Network Row Manifolds provide the physical connectivity layer between coolant distribution units, server-level cooling hardware, and heat rejection systems. Each manifold assembly is flushed, passivated, pressure-tested, and sealed to deliver superior cleanliness, corrosion resistance, and leak-free performance. The configurable design provides full system compatibility across direct-to-chip cooling, immersion cooling, and rear-door heat exchangers while simplifying coolant routing. It also enables fast deployment for new builds or retrofits, helping operators scale liquid-cooling infrastructure in weeks rather than months.
Vertiv complements its portfolio with Vertiv™ Liquid Cooling Services, covering design support, installation, and ongoing maintenance. This lifecycle approach is designed to help customers maximise efficiency, maintain system availability, and support consistent performance as liquid cooling becomes an integral part of modern data centre operations.
Vertiv experts will be available throughout Datacloud Global Congress at booth #123 to discuss Vertiv’s end to end portfolio of power, cooling, and converged infrastructure solutions designed to support high density, AI ready data centres. Explore insights and resources at Vertiv.com/AI.
To schedule a meeting with Vertiv experts at Datacloud Global Congress, click here.
About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics and ongoing services to enable its customers' vital applications to run continuously, perform optimally and grow with their business needs. Vertiv solves the most important challenges facing today's data centres, communication networks and commercial and industrial facilities with a portfolio of power, cooling and IT infrastructure solutions and services that extends from the cloud to the edge of the network. Headquartered in Westerville, Ohio, USA, Vertiv does business in more than 130 countries. For more information, and for the latest news and content from Vertiv, visit Vertiv.com.
Forward-looking statements
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27 of the Securities Act, and Section 21E of the Securities Exchange Act. These statements are only a prediction. Actual events or results may differ materially from those in the forward-looking statements set forth herein. Readers are referred to Vertiv's filings with the Securities and Exchange Commission, including its most recent Annual Report on Form 10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion of these and other important risk factors concerning Vertiv and its operations. Vertiv is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.
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