Vertiv™ CoolChip CDU 1350 | Liquid cooling for AI compute

Vertiv™ CoolChip CDU 1350

Liquid cooling built for the demands of AI compute

Data center environments are evolving with increasing AI density, ML workloads, and connected systems.

These shifts bring new capabilities, while placing additional thermal and operational demands on cooling systems, including the need to address:

Rising heat densities

AI and ML workloads push rack power densities beyond what traditional air cooling can handle.

Increased cooling demand

Higher compute density means more heat to remove, driving the need for higher-capacity cooling.

Space and layout constraints

Compact designs that deliver high cooling capacity in a small footprint are critical in constrained environments.

System reliability

Critical AI workloads need continuous cooling availability, making redundancy and leak detection essential.

Efficient operation

Optimized energy consumption and reduced reactive power help limit operating costs over the life of the system.

Ready to keep your AI workloads running?

Your AI workloads need cooling infrastructure that can keep pace with growing compute demands. Our team can help you explore how the Vertiv™ CoolChip CDU 1350 supports your liquid cooling requirements.

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Liquid cooling for demanding compute environments

Built on dependable liquid cooling technology, the Vertiv™ CoolChip CDU 1350 supports performance and continuity in demanding compute environments. We manufacture the Vertiv™ CoolChip CDU 1350 at our Johor factory, the same facility that produces our Vertiv™ SmartRun solutions. Its key capabilities include:

More cooling capacity in less space

Delivers up to 1350kW at 4°C ATD of heat rejection in just 1.1m² of floor space, supporting denser pod deployments.

Keep your critical IT
running

Triple pump configuration with N+1 redundancy helps maintain cooling continuity for your critical IT.

Precise temperature control for your most sensitive loads

±1°C secondary fluid temperature control helps eliminate thermal shock for server CPUs and GPUs.

Protect your direct-to-chip investment

Wetted materials that comply with Open Compute Project (OCP) and American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE) standards help support the longevity of your direct-to-chip investments.

Deploy where and how you need

In-row or perimeter placement with support for industry-standard communication protocols enables integration with your building management system.

Liquid cooling for demanding compute environments

More cooling capacity in less space

Delivers up to 1,368KW of heat rejection in just 1.1M² of floor space, supporting denser pod deployments.

Keep your critical IT running

Triple pump configuration with N+1 redundancy helps maintain cooling continuity for your critical IT.

Precise temperature control for your most sensitive loads

±1°C secondary fluid temperature control helps eliminate thermal shock for server CPUs and GPUs.

Protect your direct-to-chip investment

Deploy where and how you need

In-row or perimeter placement with support for industry-standard communication protocols enables integration with your building management system.

Featured solutions

Thermal management

Vertiv™ CoolChip CDU 1350, 1350kW at 4°C ATD, coolant distribution unit

Built at our Johor factory in Malaysia, the Vertiv™ CoolChip CDU 1350 reflects our focus on manufacturing close to your operations across Asia. As the latest generation of the Vertiv™ Liebert® XDU family, it delivers up to 1350kW at 4°C ATD of heat rejection in a compact 900mm x 1,242mm footprint, with N+1 pump redundancy and built-in leak detection.

Learn more

Integrated portfolio

Vertiv High Density Cooling Solutions

The Vertiv™ CoolChip CDU 1350 is part of our broader Vertiv™ High Density Cooling Solutions portfolio. From chip to ambient, our end-to-end liquid cooling portfolio spans heat rejection systems, fluid networks, coolant distribution units, and direct-to-chip technologies, supporting the evolving demands of AI and high-performance computing workloads.

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Vertiv™ CoolChip CDU 1350

Ready to keep your AI workloads running?

PRIVACY NOTICE CONSENT

Vertiv opens Johor manufacturing facility to support growing demand for AI and digital infrastructure across Asia

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