Vertiv at ASME’s InterPACK® 2025

Meet with Vertiv on-site at ASME’s InterPACK 2025 to explore advances in electronic and photonic packaging. Discover clear takeaways on power, cooling, and integration, plus direct access to experts, peers, and decision-makers. The program is built for action: real sessions, credible insights, and conversations that help you move fast.

What’s on the table:

• Thermal strategies that scale with density
• Resilient, efficient power architectures
• Packaging-to-facility integration made simple
• Translating conference insights into your roadmap

Key highlights:

• Plenary: Materials engineering innovations for advanced electronics cooling
  Prof. Ken Goodson kicks off fresh thinking on thermal performance and design choices that support energy-efficient systems.
• Industry panel: Data center power and cooling technologies
  A direct look at trade-offs shaping data centers, including density, efficiency, and reliability, featuring industry experts from leading infrastructure and technology firms.
• Plenary: Unlocking human potential through haptic sharing
  Prof. Yoshihiro Tanaka of the Nagoya Institute of Technology explores human-machine interaction and its impact on packaging and system-level design.
• Tech talk: HAMR interface reliability challenges
  Dr. Qing Dai of Western Digital discusses focused insights on storage interface reliability and its role in scaling compute.
• Special panel: Electronics packaging and smart manufacturing for AI applications
  A practical discussion on building manufacturable, AI-ready systems featuring cross-disciplinary leaders from academia and industry.

Secure your InterPACK pass and book time with Vertiv at Hotel FERA.