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Familia de productos

Vertiv™ MegaMod™ HDX: Next-Generation Prefabricated Infrastructure for AI & HPC

The Vertiv™ MegaMod™ HDX is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape— the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing. It delivers prefabricated and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, the Vertiv MegaMod HDX is designed to support the most demanding compute environments. Combining direct-to-chip liquid cooling with flexible air-cooled architectures, it effectively manages the intense heat loads generated by AI and HPC applications and provides optimal performance and reliability. It supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.

Obtener folleto
Principales ventajas
  • EXPEDITED ROLLOUT: This pre-engineered, prefabricated, and fully tested design enables significantly faster time-to-market — minimizing setup time and accelerating operational readiness.
  • SCALABLE SOLUTION: Flexible architecture supports growth of up to 10 MW and beyond.
  • HYBRID COOLING APPROACH: It is a versatile thermal solution designed to support a wide range of AI technologies powered by next-generation GPU processors by integrating direct-to-chip liquid cooling with air cooling for maximum efficiency.
  • SINGLE POINT OF CONTACT: Vertiv manages all aspects from design to deployment, streamlining the process and optimizing resources.
  • GLOBALLY AVAILABLE SERVICES: It comes with a comprehensive industry service presence, providing your business operations 24/7 expert support and protection worldwide.
El más adecuado:
  • Centro de datos/Hosting/Housing

Beneficios

  • DIRECT-TO-CHIP LIQUID COOLING: Keep critical equipment from overheating and allow top performance of AI and HPC applications.
  • PREFABRICATED INFRASTRUCTURE: The complex pipework and powertrain are fully prefabricated, simplifying and shortening the installation and startup process while reducing the potential for risks, quality issues, or delays.
  • FLEXIBLE INSTALLATION: It is available in skid-mounted units, providing flexibility options for new builds, modular retrofits, and expansions.
  • 50% FASTER ONSITE BUILD: Integrate best-in-class technologies to greatly reduce onsite deployment and commissioning complexity.
  • SYSTEM DESIGN & DEPLOYMENT: Vertiv answers your infrastructure’s need for integrated product offering, which includes power, thermal and prefabricated solutions to provide increased scalability, efficiency and reliability.

Características

  • PREFABRICATED MODULAR SOLUTION: It is deployed as a standalone modular data hall, minimizing on-site labor, reducing deployment time, and providing consistent quality.
  • PURPOSE-BUILT FOR AI AND HPC: It is optimized for Pod-style AI deployments and similar high-density configurations.
  • FULLY INTEGRATED DATA CENTER SOLUTION: A complete, end-to-end solution built on Vertiv’s integrated portfolio, bringing together all critical components for optimal performance.
  • QUALITY ASSURED: Factory-integrated components passed rigorous testing.
  • VERTIV™ UNIFY ONBOARD INTELLIGENCE SOLUTION: With Vertiv™ Unify, this solution delivers advanced monitoring, control, and automation, simplifying data center operations into a single, unified interface.

*Para ver las descargas específicas del modelo, necesita ir a la página de producto seleccionando el nombre del producto en el gráfico de especificaciones que aparece más arriba.

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Contactos de asistencia de productos
Mostrando contactos para California, 91733, USA Cambio
Vertiv™ Services
610 Executive Campus Drive Westerville Ohio 43082 USA
Áreas de interés de producto: Sistemas de Alimentación Ininterrumpida (SAI), Distribución de potencia, Thermal Management, Soluciones integradas, Racks y cerramientos

Vertiv™ MegaMod™ HDX in 3D

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