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제품 모델

Vertiv™ CoolChip CDU, 600kW

Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600kW is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.

브로슈어 다운로드
주요 이점
• Essential separation of the primary (facility) liquid loop, from the secondary (ITE) cooling loop • Deliver exceptional direct-to-chip and RDHx cooling capacity to accommodate high density racks • Improved quality and reliability with redundant pumps, built-in filtration, and unit-to-unit communication capabilities
적합한 용도:
  • Data Center/Colocation/Hosting
  • Education
  • Government
  • Healthcare
  • Retail and Wholesale

복지

• Achieve incredible efficiency in high-density environments • Protects secondary liquid network with strict confornance to wetted material compatibility • Intuitively designed for ease of deployment • Accomodates any facility design and with multiple cooling configurations • Robust design with confidence inspiring redundancy options including teaming for the most demanding applications • Integrated controller designed from the ground up to be easy and supports leak detection • Flexible support services available for installation and maintenance with same day options

특징

• Compact footprint allows for in-row deployments • Top or bottom liquid supply & return connections • Integrated 50 micron filter • Large 7" responsive color touch screen display • Precise temperature control to eliminate thermal shock for server CPU and GPUs • Intelligent flow monitoring with alarm features • Closed-loop pipe design with integrated leak detection • Easily accessible fill port and drain locations • Innovative Stainless-Steel Designand Hygenic Couplings help ensure Secondary Fluid Network integrity

As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.

*모델별 다운로드를 보려면 위 사양 차트에서 모델명을 선택하여 모델별 제품 페이지로 가야 합니다.

지역 연락처 찾기

제품 지원 연락처
연락처 보기 California, 91733, USA 변경
Vertiv™ Services
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
제품 중점 영역: 무정전 전원 공급장치(UPS), 배전설비, 열 관리, 통합 솔루션, 랙과 컨테인먼트 솔루션
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
제품 중점 영역: 열 관리
PORTALS
개요
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