Vertiv™ CoolChip CDU, 600kW
Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600kW is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
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- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Vertiv™ CoolChip CDU, 600kW
Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600kW is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
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As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.
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