- Vertiv at DCD>Connect New York 2026: Advancing AI‑ready data center infrastructure
- 2026-03-22 16:00
- 2026-03-23 16:00
- 3월 22 - 3월 23, 2026
- Marriott Marquis, Times Square, New York, NY, USA
Marriott Marquis, Times Square, New York, NY, USA
Booth #12 | March 23-24, 2026
A fast‑paced look at how data centers are transforming into full AI Units of Compute. The session walks through the rapid shift in power system architectures—expanding from traditional AC designs to a broader mix of DC, MV UPS, 50VDC, and 800VDC configurations—to meet the demands of next‑generation AI workloads. It highlights how Vertiv’s portfolio is evolving to support this shift, from power modules, switchgear, UPS systems, and batteries to emerging 50V and 800V power shelves and NVIDIA‑aligned source‑to‑load designs. The discussion frames how these architectures come together to power dense GPU environments and enable the future of AI‑driven data centers.
Session details:

Peter leads strategic customer development for Vertiv’s power business, helping solve complex challenges with advanced power and control technologies. With deep expertise in power systems for AI applications, he champions the “Bring Your Own Power” approach to reducing utility dependence. Over his 30+ years in critical infrastructure, he has held executive roles including VP Engineering and VP/GM AC Power. Peter is a frequent industry speaker and media spokesperson, and a contributing author to the 2024 book Greener Data Vol. 2.
Explore the Vertiv™ 360AI Mini Solution—integrating rack power distribution, containment, UPS systems, batteries, and liquid‑cooling modules to accelerate AI pilot clusters and scale into production. Includes Vertiv design, commissioning, and lifecycle performance services.
Experience the Vertiv™ 360AI power train featuring Vertiv™ Trinergy™ and Vertiv™ APM2 UPS, Vertiv™ EnergyCore battery cabinets, Vertiv™ PowerBoard switchgear, Vertiv™ PowerBar busway, Vertiv™ PowerIT rPDUs, and VR racks. Learn how Vertiv engineering and lifecycle services support faster, repeatable AI infrastructure rollouts.
Explore the Vertiv™ CoolChip fluid network architecture with CDUs, Vertiv™ CoolLoop RDHx, condensers, perimeter systems, and chillers. See how these thermal designs support high‑density clusters and heat‑reuse pathways. Vertiv services cover assessment through operations for smooth integration.
See how Vertiv controls, monitoring, and orchestration software unify thermal and power telemetry for coordinated response to millisecond‑level GPU load changes. Service teams support integration with existing data center management tools.