Vertiv™ MegaMod™ HDX: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ HDX is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape— the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing. It delivers prefabricated and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, the Vertiv MegaMod HDX is designed to support the most demanding compute environments. Combining direct-to-chip liquid cooling with flexible air-cooled architectures, it effectively manages the intense heat loads generated by AI and HPC applications and provides optimal performance and reliability. It supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
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- Datacenter / Colocation / Hébergement
Vertiv™ MegaMod™ HDX: Next-Generation Prefabricated Infrastructure for AI & HPC
The Vertiv™ MegaMod™ HDX is a next-generation infrastructure solution engineered to meet challenges driven by rapidly evolving digital landscape— the growth of generative Artificial Intelligence, Machine Learning, and High-Performance Computing. It delivers prefabricated and fully integrated cooling and power systems tailored for Pod-style AI deployments and similar high-density configurations. With scalability up to 10 MW, the Vertiv MegaMod HDX is designed to support the most demanding compute environments. Combining direct-to-chip liquid cooling with flexible air-cooled architectures, it effectively manages the intense heat loads generated by AI and HPC applications and provides optimal performance and reliability. It supports a wide range of AI data center topologies and cooling technologies, giving you the freedom to design infrastructure that fits your specific application.
- Datacenter / Colocation / Hébergement
Avantages
- DIRECT-TO-CHIP LIQUID COOLING: Keep critical equipment from overheating and allow top performance of AI and HPC applications.
- PREFABRICATED INFRASTRUCTURE: The complex pipework and powertrain are fully prefabricated, simplifying and shortening the installation and startup process while reducing the potential for risks, quality issues, or delays.
- FLEXIBLE INSTALLATION: It is available in skid-mounted units, providing flexibility options for new builds, modular retrofits, and expansions.
- 50% FASTER ONSITE BUILD: Integrate best-in-class technologies to greatly reduce onsite deployment and commissioning complexity.
- SYSTEM DESIGN & DEPLOYMENT: Vertiv answers your infrastructure’s need for integrated product offering, which includes power, thermal and prefabricated solutions to provide increased scalability, efficiency and reliability.
Caractéristiques
- PREFABRICATED MODULAR SOLUTION: It is deployed as a standalone modular data hall, minimizing on-site labor, reducing deployment time, and providing consistent quality.
- PURPOSE-BUILT FOR AI AND HPC: It is optimized for Pod-style AI deployments and similar high-density configurations.
- FULLY INTEGRATED DATA CENTER SOLUTION: A complete, end-to-end solution built on Vertiv’s integrated portfolio, bringing together all critical components for optimal performance.
- QUALITY ASSURED: Factory-integrated components passed rigorous testing.
- VERTIV™ UNIFY ONBOARD INTELLIGENCE SOLUTION: With Vertiv™ Unify, this solution delivers advanced monitoring, control, and automation, simplifying data center operations into a single, unified interface.
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