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Data Center Investment
Conference & Expo (DICE) National 2025

May 20 – May 22, 2025

DICE National 2025: Vertiv’s expertise on AI and high-density cooling

Vertiv recently took center stage at the Data Center Investment Conference & Expo (DICE) National 2025, held from May 20–22 in Leesburg, VA. This premier event united data center professionals to address the growing challenges of power and thermal management in the era of AI-driven, high-density workloads.

DICE 2025 image

A key highlight of Vertiv’s participation was the featured session:

“The future of data center cooling: How will high-density chips impact cooling and power infrastructure?”

Moderated by Greg Stover, Vertiv’s Global Director, Hi-Tech Development, the panel delved into how compute-intensive applications are driving a fundamental transformation in infrastructure design. The discussion offered actionable insights on how industry leaders can adapt today to meet the demands of tomorrow’s high-performance workloads.

Key takeaways


1. Integrated infrastructure for AI workloads

Vertiv™ 360AI portfolio delivers a unified approach to power, cooling, and lifecycle services for AI-ready data centers. Designed to support the demands of high-density computing, Vertiv™ 360AI helps operators improve efficiency and reliability across critical systems.

2. Advanced cooling strategies for next-gen chips

As GPU-accelerated and AI workloads drive higher rack power densities, traditional thermal solutions no longer suffice. Vertiv showcased latest innovations—such as pumped refrigerant chillers, liquid cooling systems, and intelligent thermal monitoring—engineered for the demands of modern data centers.

3. Lifecycle support with liquid cooling services

Vertiv’s Liquid Cooling Services offers comprehensive support, from planning and installation to maintenance and optimization. Certified service teams help maintain the long-term reliability and operational continuity of advanced cooling systems in AI and HPC environments.

4. Live demonstrations and technical engagement

Attendees who visited the Vertiv booth experienced hands-on demos of cooling and monitoring solutions built to support next-generation infrastructure. Our team engaged directly with participants to discuss tailored strategies for power and thermal optimization—reinforcing our customer-first, solutions-led approach.

 

Talk with a Vertiv representative

Interested in how Vertiv can help optimize your AI or high-density data center infrastructure?
Fill out the form below and our technical consultants will connect with you within 1–2 business days. .

DICE 2025 image

Looking ahead


Whether you joined us at DICE National 2025 or are exploring ways to evolve your data center, Vertiv is here to help. Our expertise, technologies, and service capabilities are built to meet the growing demands of AI, high-performance computing, and edge deployments.

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