Product Family

Vertiv™ CoolChip CDU

The Vertiv™ CoolChip CDU is designed to support liquid cooling within high-density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select among in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.

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Key Benefits

FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high density racks.
REDUCED TOTAL COST OF OWNERSHIP: Get cost savings with high-efficiency, high-density cooling.
PEACE OF MIND: Get equipped with redundant pumps, built-in filtration, and unit-to-unit communication capabilities.
RAPID DEPLOYMENT: Easily and quickly install/deploy in any data center environment with in-row or perimeter placement.

Best Suited For:

Data Center/Colocation/Hosting
Education
Government
Healthcare
Retail and Wholesale

Product Family

Vertiv™ CoolChip CDU

Get Brochure

Key Benefits

FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high density racks.
REDUCED TOTAL COST OF OWNERSHIP: Get cost savings with high-efficiency, high-density cooling.
PEACE OF MIND: Get equipped with redundant pumps, built-in filtration, and unit-to-unit communication capabilities.
RAPID DEPLOYMENT: Easily and quickly install/deploy in any data center environment with in-row or perimeter placement.

Best Suited For:

Data Center/Colocation/Hosting
Education
Government
Healthcare
Retail and Wholesale

As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of Vertiv™ Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. Its compact footprint allows for in-rack, end of row, or perimeter placement options.

Model Specifications Overview

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Vertiv™ CoolChip CDU 70
Models			Height	Width	Depth
Vertiv™ CoolChip CDU 70	70.0 kW at 11C approach temperature difference	10,100 m3/h (5,945 CFM)	91 in	24 in	48 in
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Vertiv™ CoolChip CDU 121
Vertiv™ CoolChip CDU 121	121 kW at 7.2⁰F (4⁰C) approach temperature difference	N/A, Liquid-to-Liquid	6.8 in	17.5 in	34.2 in
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Vertiv™ CoolChip CDU 150
Vertiv™ CoolChip CDU 150	121 kW at 7.2⁰F (4⁰C) approach temperature difference
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Vertiv™ CoolChip CDU 600
Vertiv™ CoolChip CDU 600	600kW at 7.2 F (4.0 C) approach temperature difference	N/A, Liquid-to-Liquid	78.7 in	23.6 in	47.2 in
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Vertiv™ CoolChip CDU 1350
Vertiv™ CoolChip CDU 1350	1350kW at 7.2F (4C°) approach temperature difference	N/A, Liquid-to-Liquid	83.5 in	35.4 in	48.9 in
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Vertiv™ CoolChip CDU 2300
Vertiv™ CoolChip CDU 2300	2300kW at 7.2F (4C) approach temperature difference	N/A, Liquid-to-Liquid	94.5 in	48 in	48 in
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* To view a specific model product page click on the model name above.

Benefits

ACHIEVE HIGHER EFFICIENCY & RELIABILITY: The Vertiv™ CoolChip CDU provides greater efficiency and redundancy options for high-density environments.
PROTECT SECONDARY LIQUID NETWORK: Designed with strict wetted material compatibility, it protects the secondary liquid network from contamination and degradation.
EASILY DEPLOY: Intuitively designed for easy deployment.
GET FLEXIBLE DESIGN: It accommodates any facility design and multiple cooling configurations.
HAVE PACKED FEATURES: Its integrated controller is designed from the ground up to be easy to deploy and to support leak detection.
ACCESS READY SUPPORT: It offers service support with local installation and same-day maintenance.

Features

COMPACT FOOTPRINT: Allow for in-row deployments.
INTEGRATED 50 MICRON FILTER: Keep supply water contaminant-free to protect server integrity and performance.
PRECISE TEMPERATURE CONTROL: Eliminate thermal shock for server CPU and GPUs.
INTELLIGENT FLOW MONITORING WITH ALARM FEATURES: Help maintain system performance and efficiency.
EASILY ACCESSIBLE FILL PORT & DRAIN LOCATIONS: Streamline and simplify maintenance.
INNOVATIVE STAINLESS-STEEL DESIGN & HYGIENIC COUPLINGS: Help Secondary Fluid Network integrity.

Brochures and Data Sheets

Warranties

Vertiv™ Liebert® Optional Prime Labor Warranty - English

Technical Specifications

Vertiv™ CoolChip CDU 600/1350 Guide Specifications SL-80239

*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.

Find Your Area Contact

Products Support Contacts

Products Support Contacts Showing contacts for USA Change

Vertiv™ Services

+1 800 543 2378

610 Executive Campus Drive Westerville Ohio 43082 USA

Product areas of focus: Uninterruptible Power Supplies (UPS), Power Distribution, Thermal Management, Integrated Solutions, Racks and Containment

Vertiv Academy – Thermal Management Training

+1 844 841 2665

530 Westar Blvd Westerville Ohio 43082 USA

Product areas of focus: Thermal Management

Frequently Asked Questions

What is the Vertiv™ CoolChip CDU?

The Vertiv™ CoolChip CDU is a coolant distribution unit designed to support liquid cooling within high-density data center environments. It delivers cooling for direct-to-chip and rear door heat exchanger applications using either liquid-to-liquid or liquid-to-air heat exchange technology. The family includes models with capacity ranging from 70 kW to 1350+ kW, accommodating diverse deployment requirements.

What applications is Vertiv™ CoolChip CDU designed for?

The Vertiv™ CoolChip CDU is designed for high-density computing applications including artificial intelligence, machine learning, high-performance computing, and data-intensive workloads. It serves hyperscale data centers, colocation facilities, enterprise data centers, and edge computing deployments requiring advanced thermal management. The liquid to air system works particularly well in facilities transitioning from traditional air to liquid cooling.

How does the Vertiv™ CoolChip CDU differ from traditional air cooling systems?

Vertiv™ CoolChip CDU differs from traditional air cooling by directly cooling server components with liquid rather than relying solely on air circulation. Liquid cooling typically removes heat more efficiently than air, enabling higher rack densities and reduced energy consumption. Vertiv™ CoolChip CDU 70 model uses liquid-to-air heat exchange, allowing deployment in existing air-cooled facilities without requiring facility water connections or major infrastructure modifications.

What are the key features of Vertiv™ CoolChip CDU?

The Vertiv™ CoolChip CDU features redundant variable-speed pumps for reliable coolant circulation and energy-efficient operation. An integrated 50 or 25-micron filter maintains supply water quality to protect server components from contamination. The unit includes a 7-inch color touchscreen display for local monitoring and control. Precise temperature control capabilities help minimize thermal shock to server CPUs and GPUs.

How does the Vertiv™ CoolChip CDU reduce total cost of ownership for liquid cooling?

Vertiv™ CoolChip CDU reduces total cost of ownership through several mechanisms. The Vertiv™ CoolChip CDU 70 model eliminates the capital expense of extending facility water infrastructure to server racks, lowering initial deployment costs for liquid cooling adoption. Variable-speed pump controls and flow modulation reduce electrical consumption by matching coolant delivery to actual cooling demand rather than running at constant full capacity.

Vertiv™ CoolChip CDU

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Vertiv™ CoolChip CDU