Meet AI’s cooling demands with the
Vertiv™ CoolLoop Trim Cooler
Rising power densities from AI workloads are pushing the limits of data center thermal management. The Vertiv™ CoolLoop Trim Cooler and Vertiv™ CoolChip CDU are purpose-built to efficiently dissipate high heat loads, optimizing liquid cooling performance in high-density environments.
What sets Vertiv™ CoolLoop Trim Cooler apart
Up to 40°C leaving water temperature
AI densification-ready, enabling scalable, next-gen infrastructure.
Up to 3MW cooling capacity
Compact and efficient design to support high-density infrastructure
Up to 70% increase in efficiency
Offers significant energy savings, maximizing free cooling and reducing operational costs over time.
Up to 40%
less space
Minimizes equipment footprint. Ideal for scaling and mass densification.
-20°C to 52°C global operating range
Global operating range can handle extreme climates—from icy cold to desert heat.
Vertiv™ CoolLoop Trim Cooler and iGenius Colosseum: the future is sovereign. AI is no longer theoretical – it’s being built now.
A first-of-its-kind deployment between iGenius, Vertiv, and NVIDIA, set to become one of the world's largest sovereign AI data centers. Vertiv™ CoolLoop Trim Cooler is the high-density, energy-efficient cooling solution designed to support the deployment of this hybrid-cooled AI supercomputer data center.
Success starts right where you are
Vertiv™ CoolLoop Trim Cooler
The Vertiv™ CoolLoop Trim Cooler is the free cooling AI-ready, densification-ready, environmentally responsible solution specifically designed to prepare data centers for growing densification driven by AI advancements.
Vertiv™ CoolChip CDU
The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.
Blog
High temperature fluid coolers
Evaluate how the Vertiv™ CoolLoop Trim Cooler can turn next-gen AI and high-density challenges into a clear advantage while envisioning the future and create an infrastructure solution that evolves with the technology.
Explore air + liquid solutions for high-density AI performance
Talk to us
Fill out the details to have our AI solutions consultants get back to you.
Your submission has been received!
Thank you for reaching out to us.
References
