Vertiv™ CoolChip Fluid Network, Row Manifolds
The Vertiv™ CoolChip Fluid Network Row Manifolds are a modular, in-row solution for efficient coolant distribution. Its flexible design enables seamless integration, rapid deployment, and easy scalability to suit high-density AI and HPC environments. It also supports 1-phase direct-to-chip cooling, making it compatible with Vertiv and third-party CDUs for reliable thermal management.
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- Construction and Engineering
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
- Sales Engineers
Vertiv™ CoolChip Fluid Network, Row Manifolds
The Vertiv™ CoolChip Fluid Network Row Manifolds are a modular, in-row solution for efficient coolant distribution. Its flexible design enables seamless integration, rapid deployment, and easy scalability to suit high-density AI and HPC environments. It also supports 1-phase direct-to-chip cooling, making it compatible with Vertiv and third-party CDUs for reliable thermal management.
- Construction and Engineering
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
- Sales Engineers
Benefits
- 1-PHASE, DIRECT-TO-CHIP COOLING-COMPATIBLE: It is compatible with both Vertiv and third-party CDUs to support flexible and efficient thermal management.
- MODULAR DESIGN: It enables rapid deployment and seamless integration across diverse facility layouts, cooling topologies, and evolving capacity requirements.
- EXPERT INSTALLATION AND COMMISSIONING SERVICES: It includes dependable technical support that shortens on-site time and allows a fast and accurate setup, helping you reduce operational delays.
Features
- SANITARY STAINLESS STEEL CONSTRUCTION: It utilizes tri-clamp connections that enable clean, leak-resistant operation.
- STANDARD HEADER SIZES: It enables easy integration and compatibility across diverse applications with convenient 4” and 6” sizes with matching 2” and 3” branch ports.
- CONFIGURABLE BRANCH CONNECTIONS: It offers multiple flow control valve, coupling, and flexible hose options to support application-specific configurations.
- TAILORED SYSTEM COMPONENTS: It enables customized system configurations that simplify operations with a selection of valves, elbows, tees, bypasses, and accessories.
- OVERHEAD AND UNDERFLOOR DEPLOYMENT OPTIONS: Its integrated drip pans and modular frames facilitate easy installation.
Specifications
The Vertiv™ CoolChip Fluid Network includes in-rack and in-row manifold configurations for efficient, direct-to-chip liquid cooling in high-density AI and HPC environments. Its flexible, quality-tested design enables seamless integration, rapid deployment, and scalability. It provides clean, reliable coolant distribution with stainless steel construction and customizable port options for tailored deployments. It is also compatible with Vertiv and third-party CDUs for streamlined integration and broader compatibility across data center environments.