Vertiv™ CoolChip CDU 600
Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600 is suitable for direct-to-chip and rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
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- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Vertiv™ CoolChip CDU 600
Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600 is suitable for direct-to-chip and rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Benefits
- Higher efficiency and reliability: Achieve greater efficiency and have redundancy options for high-density environments
- Protects secondary liquid network with strict conformance to wetted material compatibility
- Easy deployment: Intuitively designed for easy deployment
- Flexible design accommodates any facility layout with multiple cooling configurations
- Packed features: Integrated controller designed from the ground up to be easy to deploy and supports leak detection
- Ready support: Industry-leading service support with local installation and same-day maintenance
Features
- Compact footprint allows for in-row deployments
- Integrated 50-micron secondary filter keeps supply water contaminant-free to protect server integrity and performance
- Precise temperature control eliminates thermal shock for server CPUs and GPUs
- Intelligent flow monitoring with alarm features helps maintain system performance and efficiency
- Easily accessible fill port and drain locations streamline and simplify maintenance
- Innovative stainless-steel design and hygienic couplings help ensure secondary fluid network integrity
Specifications
Seamlessly transition to high-efficiency liquid cooling technology with Vertiv™ CoolChip CDU (next generation of Vertiv™ Liebert® XDU family). From hyperscale and colocation environments to edge applications, the Vertiv CoolChip CDU offers flexible deployments for rear door heat exchangers or direct contact liquid cooling. It allows for in-rack, end of row, or perimeter placement options. Easily distribute coolant to efficiently manage power dense deployments with liquid-to-liquid heat exchange up to 100 kW, 450 kW, 600 kW, or 1,350 kW, and liquid-to-air heat exchange up to 70kW. With precise temperature control, this unit can eliminate thermal shock. Have reliable operations with its redundant pumps and dual power feeds and added peace of mind with remote monitoring and communications.
- Product Specifications
- Net Sensible Nominal Capacity kBtuh[kW]*
- 600kW at 7.2 F (4.0 C) approach temperature difference
- Nominal Airflow Data Center Air (CFM, m3/h)
- N/A
- Net Sensible Nominal Capacity kBtuh[kW]*
- 600 kW at 7.2⁰F (4⁰C) approach temperature difference
- Controls and Monitoring
- Color touch screen display, Communication via Modbus RTU (RS485) and TCP/IP
- Agency Approvals
- CE, cULus, RoHS
- Key Components
- Redundant pump design, variable-speed pump controls, and integrated filtration
- Physical Characteristics
- Weight
- 1058 lbs
- Weight
- 480 kg
- Height
- 78.7 in
- Height
- 2000 mm
- Width
- 23.6 in
- Width
- 600 mm
- Depth
- 47.2 in
- Depth
- 1200 mm
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.
