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Powering AI’s future: Vertiv at SuperComputing 2025

America’s Center, 701 Convention Plaza, St. Louis, MO 63101

Booth #1507

November 16-21, 2025

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Powering AI’s future: Vertiv at SuperComputing 2025
November 15 - November 20, 2025
AI is reshaping data centers from 130 kW pods to gigawatt-scale campuses. Vertiv delivers AI-ready racks, modular power, and liquid cooling engineered for density, efficiency, and scalability. Join us at Booth 1507 to explore live demos, reference architectures, and insights from industry leaders shaping the future of AI infrastructure.

Feature highlights:

Birds of a Feather: Driving modularization, standards, and reference designs

Join industry leaders as they share real-world lessons from deploying AI infrastructure over the past 24 months. Explore how modular reference architectures accelerate AI adoption by reducing costs, improving energy efficiency, and scaling from pilot projects to hyperscale deployments.

  • Moderator: Greg Stover, Director, Business Development, Vertiv
  • Panelists: Wade Vinson (NVIDIA), John Gross (J.M. Gross Engineering), Martin Olsen (Vertiv)
  • Date: Tuesday, Nov 18th | 12:15pm-1:15pm
  • Location: Rooms: 240-241-242
About the moderator
Greg Stover, Director, Business Development, Vertiv
Greg Stover, Director, Business Development, Vertiv

With more than 30 years of experience in data center efficiency optimization with large data center enterprise operators and industry leading VARs/Resellers, Greg champions the successful leveraging and utilization of Vertiv’s comprehensive and constantly evolving portfolio of thermal, power, monitoring, and IT management solutions for the hyperscale, colocation, on-prem, DR and edge IoT ecosystems.

As a data center efficiency optimization enthusiast, Greg has a proven track record of bringing leading and bleeding edge cooling, power, monitoring and DCIM solutions and tools through introduction, implementation, and successful execution, while staying keenly focused and aligned with client/enterprise/edge operator’s goals & objectives. Greg is a frequent presenter at industry conferences, trade shows and Integrator/VAR/Partner training events.

Exhibitor forum: Scaling liquid cooling in line with the AI development roadmap

Explore how liquid cooling supports high-density AI data centers. This session covers practical approaches, including modular retrofits, hybrid air-liquid integration, and real-time management platforms, providing actionable insights to build efficient, scalable AI factories aligned with growing compute demands.

  • Moderator: Nigel Gore & Mark Luxford, Vertiv
  • Date: TBD, SC25 schedule
  • Location: TBD
About the speakers
Nigel Gore, Sr. Director, High-Density and Liquid Cooling, Vertiv
Nigel Gore, Sr. Director, High-Density and Liquid Cooling, Vertiv

Nigel joined Vertiv in 2020 to lead liquid cooling strategy and development, with an early priority to align Vertiv engineering resources with NVIDIA'S Jeremy Rodriguez and team, to support advanced development for NVIDIA at UTA, Binghamton, and Villanova. Nigel leads global engineering and product management for the Vertiv™ liquid cooling portfolio. He has a background in startup tech product development, including telecommunications, IT hardware, robotics and autonomous systems, and liquid cooling with roles at companies including Panasonic, Acer, Lenovo and Iceotope. Qualifications include an MBA specialized in digital technologies.

Mark Luxford
Mark Luxford, Principal Technologist, High-Density and Liquid Cooling, Vertiv

Mark Luxford is Principal Technologist for the High Density & Liquid Cooling business unit at Vertiv. He works with silicon vendors, OEM customers and engineering leads across the product line globally to help drive objectives for product development and future advanced development strategies.

He has more than four decades of related engineering experience across many disciplines and over 20 years’ experience in liquid cooling for data centers and HPC (high performance computing). Before Joining Vertiv, Mark co-founded Cooltera Limited in 2016 and developed a range of Cooling Distribution Units with pioneering technologies that were instantly adopted by the mainstream HPC community. As deployments of Liquid Cooled AI (GPU) Systems began to expand rapidly in 2022/23, Cooltera was acquired by Vertiv to enable the incredible expansion of manufacturing and engineering capacity we see today. Mark has been part of this transformation and now leads engineering-based discussions with many of its customers.

Live booth demos

Live booth demos: First-to-market AI solutions

  • CoreWeave GB300 NVL72: Full-rack design, 142 kW capacity, up to 70% efficiency gains with Vertiv™ CoolLoop Trim Cooler.
  • SimReady with NVIDIA Omniverse: Validate designs in near real time with digital twin simulation.
  • 800 VDC High-Voltage Architecture: Scale beyond 600 kW per rack with improved energy efficiency.
  • Overhead Prefabricated Infrastructure: Cut deployment time by up to 85% with prefabricated modular systems.

Why attend?

  • AI-ready racks: Scale up to 142 kW with integrated air/liquid cooling.
  • Proven efficiency: Trim Coolers deliver up to 70% better energy performance.
  • Faster time-to-value: Prefabricated designs reduce deployment time by 85%
  • Future-ready scale: 800 VDC enables >600 kW per rack and 4× density.
  • Open innovation: OCP-aligned solutions simplify deployment and integration.
  • Expert insights: Hear directly from Vertiv and NVIDIA leaders driving AI infrastructure.

Booth experience

Vertiv™ 360AI Cabinet & Vertiv™ SmartRun Showcase

Explore Vertiv’s complete AI infrastructure stack with interactive kiosks and immersive demos:

  • Vertiv™ SmartRun (16ft section): A featured highlight showcasing modular, scalable infrastructure
  • Vertiv™ Power Train: Vertiv™ Trinergy, Vertiv™ Liebert® APM2, Vertiv™ Lithium-Ion UPS, Vertiv™ Powerbar iMPB, Vertiv™ PowerDirect Rack
  • Vertiv™ Thermal Chain: Vertiv™ CoolChip CDU, Vertiv™ CoolPhase Flex, Vertiv™ CoolPhase CDU, Vertiv™ CoolPhase Condensers, Vertiv™ CoolLoop Chillers, Vertiv™ CoolLoop Trim Cooler, Vertiv™ CoolChip Fluid Network, Vertiv™ CoolLoop RDHx
  • Vertiv™ Rack Solutions: 70 kW (air), 130 kW (air-liquid), 300 kW (air-liquid), 600 kW+ (ultra-scale)
  • Interactive Zones: Touchscreen tables, AV wall, 1:1 meeting rooms, and digital twin models
Meet Vertiv at SC25, Booth 1507. Explore the Vertiv™ 360AI portfolio, reference architectures, and interactive demos built for AI at scale. Don’t miss our Birds of a Feather session and panel discussion with industry leaders.
 

Book a 1:1 meeting

Schedule a private consultation to get tailored guidance on AI-ready racks, liquid cooling, and modular power solutions. Secure your time to discuss your data center needs and explore scalable, high-density infrastructure.

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