The rapid proliferation of artificial intelligence (AI) applications is transforming data centers in Asia region into high-density computing environments, where graphics processing units (GPUs) for AI drive unprecedented computational demands. However, AI workloads are inherently dynamic, characterized by spiky and bursty patterns that create cascading effects on power distribution and thermal management systems.
In this paper, we explore the interplay between these workloads, the power train (from grid to rack level delivery) and the thermal chain (from heat generation to dissipation). By examining a sample AI training scenario, we demonstrate how data center infrastructure solutions regionally available in APAC region —such as Vertiv’s large power converters, the Vertiv™ CoolChip CDU, and advanced chillers—mitigate spikes and support efficiency, and scalability. These integrated approach can reduce peak demands, minimize thermal shocks, and maintain operational envelopes, helping data centers support next-generation AI workload management without compromising grid stability or equipment longevity.
