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Product Family

Vertiv™ CoolChip CDU

The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.

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Key Benefits
  • FLEXIBLE COOLING SOLUTION: Have versatile deployments through multiple system architectures and designs.
  • HIGH-DENSITY LOAD MANAGEMENT: Deliver direct-to-chip and RDHx cooling capacity to accommodate high- density racks.
  • REDUCED TOTAL COST OF OWNERSHIP: Get cost savings with high efficiency, high-density cooling capacity.
  • PEACE OF MIND: Get equipped with redundant pumps, built-in filtration, and unit-to-unit communication capabilities.
  • RAPID DEPLOYMENT: Easily and quickly install and deploy this in any data center environment with in-row or perimeter placement.
Best Suited For:
  • Data Center/Colocation/Hosting
  • Education
  • Government
  • Healthcare
  • Retail and Wholesale

Seamlessly transition to high-efficiency liquid cooling technology with Vertiv™ CoolChip CDU (next generation of Vertiv™ Liebert® XDU family). From hyperscale and colocation environments to edge applications, the Vertiv CoolChip CDU offers flexible deployments for rear door heat exchangers or direct contact liquid cooling. It allows for in-rack, end of row, or perimeter placement options. Easily distribute coolant to efficiently manage power dense deployments with liquid-to-liquid heat exchange up to 100 kW, 450 kW, 600 kW, 1,350 kW, or 2,300 kW, and liquid-to-air heat exchange up to 70 kW. With precise temperature control, this unit can eliminate thermal shock. Have reliable operations with its redundant pumps and dual power feeds and added peace of mind with remote monitoring and communications.

Model Specifications Overview
Vertiv™ CoolChip CDU 70
70.0 kW at 11C approach temperature difference   10,100 m3/h (5,945 CFM)   91 in   24 in   48 in  
Vertiv™ CoolChip CDU 121
121 kW at 7.2⁰F (4⁰C) approach temperature difference   N/A, Liquid-to-Liquid   6.8 in   17.5 in   34.2 in  
Vertiv™ CoolChip CDU 600
600kW at 7.2 F (4.0 C) approach temperature difference   N/A, Liquid-to-Liquid   78.7 in   23.6 in   47.2 in  
Vertiv™ CoolChip CDU 1350
1350kW at 7.2F (4C°) approach temperature difference   N/A, Liquid-to-Liquid   83.5 in   35.4 in   48.9 in  
Vertiv™ CoolChip CDU 2300
2300kW at 7.2F (4C) approach temperature difference   N/A, Liquid-to-Liquid   94.5 in   48 in   48 in  

Benefits

  • HIGHER EFFICIENCY & RELIABILITY: Achieve greater efficiency and have redundancy options for high-density environments.
  • PROTECTS SECONDARY LIQUID NETWORK: With strict conformance to wetted material compatibility.
  • EASY DEPLOYMENT: Intuitively designed for easy deployment.
  • FLEXIBLE DESIGN: Accommodates any facility design and with multiple cooling configurations.
  • PACKED FEATURES: Integrated controller designed from the ground up to be easy to deploy and supports leak detection.
  • READY SUPPORT: Access service support with local installation and same-day maintenance support.

Features

  • COMPACT FOOTPRINT: Allow for in-row deployments.
  • INTEGRATED 50 MICRON FILTER: Keep supply water contaminant-free to protect server integrity and performance.
  • PRECISE TEMPERATURE CONTROL: Eliminate thermal shock for server CPU and GPUs.
  • INTELLIGENT FLOW MONITORING WITH ALARM FEATURES: Help maintain system performance and efficiency.
  • EASILY ACCESSIBLE FILL PORT & DRAIN LOCATIONS: Streamline and simplify maintenance.
  • INNOVATIVE STAINLESS-STEEL DESIGN & HYGIENIC COUPLINGS: Help Secondary Fluid Network integrity.

Find Your Area Contact

Products Support Contacts
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Vertiv™ Services
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
Product areas of focus: Uninterruptible Power Supplies (UPS), Power Distribution, Thermal Management, Integrated Solutions, Racks and Containment
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
Product areas of focus: Thermal Management

Frequently Asked Questions

The Vertiv™ CoolChip CDU is a coolant distribution unit designed to support liquid cooling within high-density data center environments. It delivers cooling for direct-to-chip and rear door heat exchanger applications using either liquid-to-liquid or liquid-to-air heat exchange technology. The family includes models with capacity ranging from 70 kW to 1350+ kW, accommodating diverse deployment requirements.
The Vertiv™ CoolChip CDU is designed for high-density computing applications including artificial intelligence, machine learning, high-performance computing, and data-intensive workloads. It serves hyperscale data centers, colocation facilities, enterprise data centers, and edge computing deployments requiring advanced thermal management. The liquid to air system works particularly well in facilities transitioning from traditional air to liquid cooling.
Vertiv™ CoolChip CDU differs from traditional air cooling by directly cooling server components with liquid rather than relying solely on air circulation. Liquid cooling typically removes heat more efficiently than air, enabling higher rack densities and reduced energy consumption. Vertiv™ CoolChip CDU 70 model uses liquid-to-air heat exchange, allowing deployment in existing air-cooled facilities without requiring facility water connections or major infrastructure modifications.
The Vertiv™ CoolChip CDU features redundant variable-speed pumps for reliable coolant circulation and energy-efficient operation. An integrated 50 or 25-micron filter maintains supply water quality to protect server components from contamination. The unit includes a 7-inch color touchscreen display for local monitoring and control. Precise temperature control capabilities help minimize thermal shock to server CPUs and GPUs.
Vertiv™ CoolChip CDU reduces total cost of ownership through several mechanisms. The Vertiv™ CoolChip CDU 70 model eliminates the capital expense of extending facility water infrastructure to server racks, lowering initial deployment costs for liquid cooling adoption. Variable-speed pump controls and flow modulation reduce electrical consumption by matching coolant delivery to actual cooling demand rather than running at constant full capacity.
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