Vertiv™ CoolChip CDU 2300
Vertiv™ CoolChip CDU 2300 is designed to support liquid cooling within high- density environments. It is ideal for direct-to-chip and rear door cooling applications offering easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU 2300 utilizes a liquid-to-liquid heat exchange design, allowing users to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
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- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Vertiv™ CoolChip CDU 2300
Vertiv™ CoolChip CDU 2300 is designed to support liquid cooling within high- density environments. It is ideal for direct-to-chip and rear door cooling applications offering easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU 2300 utilizes a liquid-to-liquid heat exchange design, allowing users to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.
- Data Center/Colocation/Hosting
- Education
- Government
- Healthcare
- Retail and Wholesale
Benefits
- HIGHER EFFICIENCY & RELIABILITY: Achieve greater efficiency and have redundancy options for high-density environments.
- PROTECTS SECONDARY LIQUID NETWORK: With strict conformance to wetted material compatibility.
- EASY DEPLOYMENT: Intuitively designed for easy deployment.
- FLEXIBLE DESIGN: Accommodates any facility design and with multiple cooling configurations.
- PACKED FEATURES: Integrated controller designed from the ground up to be easy to deploy and supports leak detection.
- READY SUPPORT: Access service support with local installation and same-day maintenance support.
Features
- COMPACT FOOTPRINT: Allow for in-row deployments.
- INTEGRATED 50 MICRON FILTER: Keep supply water contaminant-free to protect server integrity and performance.
- PRECISE TEMPERATURE CONTROL: Eliminate thermal shock for server CPU and GPUs.
- INTELLIGENT FLOW MONITORING WITH ALARM FEATURES: Help maintain system performance and efficiency.
- EASILY ACCESSIBLE FILL PORT & DRAIN LOCATIONS: Streamline and simplify maintenance.
- INNOVATIVE STAINLESS-STEEL DESIGN & HYGIENIC COUPLINGS: Help Secondary Fluid Network integrity.
Specifications
As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (next generation of Vertiv™ Liebert® XDU family) simplifies your work with the flexibility to support rear-door heat exchangers or direct-to-chip liquid cooling. Its compact footprint allows for in-rack, end-of-row, or perimeter placement options.
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.