Vertiv™ CoolLoop Trim Cooler - The free cooling AI-ready cooler from 850 to 2600 W
The Vertiv™ CoolLoop Trim Cooler is the free cooling, AI-ready, densification-ready, environmentally responsible cooling solution from 850W to 2600W (up to 3000W in air-cooled configurations). This advanced cooling technology enables dense, free cooling chillers to operate efficiently at return water temperatures up to 50°C. It offers the flexibility to scale from traditional compute environments with 20–22°C water supply to hotter AI workloads while maintaining compactness, modularity, and precision. By strategically designing cooling systems to avoid the inefficiencies and risks of static designs, data center owners can seamlessly adapt to the evolving needs of AI-driven infrastructure.
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Vertiv™ CoolLoop Trim Cooler - The free cooling AI-ready cooler from 850 to 2600 W
The Vertiv™ CoolLoop Trim Cooler is the free cooling, AI-ready, densification-ready, environmentally responsible cooling solution from 850W to 2600W (up to 3000W in air-cooled configurations). This advanced cooling technology enables dense, free cooling chillers to operate efficiently at return water temperatures up to 50°C. It offers the flexibility to scale from traditional compute environments with 20–22°C water supply to hotter AI workloads while maintaining compactness, modularity, and precision. By strategically designing cooling systems to avoid the inefficiencies and risks of static designs, data center owners can seamlessly adapt to the evolving needs of AI-driven infrastructure.
- Banking, Financial and Insurance
- Data Center/Colocation/Hosting
- Government
- Manufacturing
Specifications
The Vertiv™ CoolLoop Trim Cooler has a cooling capacity range from 850W to 2600W, and up to 3000*W in air-cooled configurations. It is designed to help prepare your infrastructure for growing densification driven by AI advancements. As a next generation cooling solution, the Vertiv CoolLoop Trim Cooler relies not only on liquid cooling, but also on air- and hybrid-coolers capable of managing unpredictable fluid temperatures.
Benefits
- LIQUID COOLING, AI FACTORIES-READY: Supports AI-driven densification advancements combining both air and liquid cooling capacity.
- MAXIMISED FREE COOLING EFFICIENCY: Handles operational peaks while minimizing power consumption. Achieve up to 1.087 pPUE, with an efficiency increase of nearly 70%* reducing indirect emissions.
- NO WATER CONSUMPTION: A dry operation reduces operational complexity, helps eliminate water waste, and removes dependence on water supplies or treatment infrastructure.
- ECO-CONSCIOUS COOLING: Compliant with major current and future bans and EU F-Gas regulations for years to come, lowering CO2e direct emissions while granting maximum seasonal efficiency, especially at partial load.
- SPACE EFFICIENT: No additional roof space occupancy is required. Net gain of over 40% cooling capacity without increasing the overall footprint.
- GLOBAL FLEXIBILITY: Suitable for data centers in various climates around the world.
*Air-cooled IT load of 10 MW running at 80% capacity with water temperatures at 20°C achieving a pPUE of 1.15 with standard chillers. At a higher temperature of 35°C with Vertiv™ CoolLoop Trim Cooler achieving a higher pPUE estimated at 1.087 and an efficiency increase of nearly 70%.
Features
- SEAMLESS LIQUID COOLING INTEGRATION: Up to 40°C supply water temperature enabling cold plates to function at 45°C; up to 50°C in the return. Easy coupling with Vertiv™ CoolChip CDU and Vertiv™ Chilled Water solutions.
- FREE COOLING OPTIMISATION: Free cooling coils designed for high ambient temperatures incorporating microchannel heat exchangers for superior heat transfer.
- INVERTER DRIVEN TECHNOLOGY: Compressors, EC fans, and pumps allow the system to operate efficiently even during operational peaks, modulating the speed of the compressor according to the demand.
- REFRIGERANTS: Very low-GWP R1234ze refrigerant with GWP = 7 as per IPCC AR4.
- SPACE SAVING DESIGN: Up to almost 3 MW** of cooling capacity in a single, compact frame with active harmonic filters inside the electrical panel.
- COOL EVERYWHERE: Available in a wide range of ambient temperatures from -20°C to over 52°C.
**In the air-cooled configuration
*To see model-specific downloads, you will need to go to the model-specific product page by selecting the model name in the specifications chart above.
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Related Products And Services
The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.
