To equip you with the tools and insights to navigate the evolving AI ecosystem, join AI Week to learn from broadcasts, supplements, surveys, opinion pieces, eBooks, and polling which will provide depth and practical insights into the latest in HPC infrastructure.
Scaling, efficiency, and resiliency of AI infrastructure
AI workloads continue to evolve at breakneck speed, demanding an unprecedented combination of power, cooling, and operational agility. But how do we determine the scalability, and reliability of AI infrastructure as we enter the next phase of its adoption? Join this discussion to explore the evolving role of AI in shaping data center infrastructure and discover:
- Is the market evolving as expected, or are we entering uncharted territory?
- Power and cooling challenges in ultra-high-density AI environments
- The importance of a systems solution approach in balancing efficiency, uptime, and performance
- Vertiv’s latest innovations in end-to-end infrastructure for AI scalability
- What’s next? Emerging technologies and the future state of AI-ready facilities
Schedule:
Date: Monday, July 28, 2025
Time: 09:00 AM - 10:00 AM ET
Watch on demand
Speakers
Giordano Albertazzi
CEO, Vertiv
Energy independence strategies for AI beyond the grid
As AI workloads place extreme demands on power availability, relying solely on the grid is no longer a viable strategy. This session examines tailored power strategies for colocation/cloud operators versus enterprises, particularly those seeking greater control through on-site generation, energy storage, and dynamic grid interactions. This session explores:
- How hyperscale and colocation operators are rethinking grid reliance with large-scale, integrated power ecosystems
- Why enterprises are adopting on-site generation, energy storage, an BYOP (Bring Your Own Power) strategies
- The evolving role of UPS, battery energy storage systems (BESS) alternative fuels, and microgrids in building AI-ready power resilience
- Learn from use cases showcasing diverse power strategies tailored to different operator profiles and AI workload demands
Schedule:
Date: Tuesday, July 29, 2025
Time: 11:00 AM - 12:00 NN ET
Watch on demand
Speakers
Peter A. Panfil
Vice President of Global Power, Vertiv
Alex Dickins
Content Director, DCD
Engineering thermal resilience for next-gen workloads
As power densities skyrocket, next-generation cooling technologies must step up to prevent performance throttling and efficiency losses. Discover the changing requirements beyond general trends and explore what large colos/cloud providers are demanding versus what enterprise operators are prioritizing, from space, budget, to regulatory constraints.This discussion will explore:
- Hybrid cooling strategies for AI from liquid and air to immersion
- Advanced fluid cooling techniques - direct-to-chip vs. immersion cooling
- The rise of AI-optimized thermal monitoring and automation
- Partnership-driven innovation: How to co-design solutions with chipmakers
Schedule:
Date: Wednesday, July 30, 2025
Time: 12:00 NN - 01:00 PM ET
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Speakers
Steve Madara
VP, Thermal, Data Centers, Vertiv
Kat Sullivan
Head of Channels, Compute, DCD
Redefining density for AI scale
Scaling AI workloads requires more than just adding more GPUs into racks. The entire facility, from chip design to cooling architecture, must evolve to accommodate densities that challenge traditional infrastructure. Collaboration with leading technology partners like NVIDIA is essential, as their innovation at the silicon and system level drives new requirements for power, thermal design, and real-time performance optimization. This session dives into:
- Engineering for extreme power densities, beyond 100kW per rack
- The impact of AI model scaling on facility power distribution
- How modularity and prefabrication accelerate AI deployment
- Technical deep dive into AI workloads
- Chip innovation, and performance optimization
Schedule:
Date: Thursday, July 31, 2025
Time: 10:00 AM - 11:00 AM ET
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Speakers
Greg Stover
Global Director, Hi-Tech Development, Vertiv
Dr. Ali Heydari
Data Center Technologist, NVIDIA
Kat Sullivan
Head of Channels, Compute, DCD
The AI data center of the future: Where are we headed?
As AI compute demands scale beyond current projections, the next decade will bring fundamental shifts in infrastructure, operations, and sustainability. Will AI architectures move beyond the hyperscale model? What new materials, power sources, and technologies will define the next generation of AI infrastructure? In this session, industry leaders examine:
- The transition from AI-specific to AI-first infrastructure
- Emerging AI workload optimization techniques to reduce energy waste
- How quantum computing, neuromorphic chips, and quantum silicon could reshape data center design
- The role of photonics in accelerating AI data transfer and reducing latency
- Navigating supply chain risks and geopolitical challenges in AI hardware
Schedule:
Date: Friday, August 01, 2025
Time: 09:00 AM - 10:00 AM ET
Watch on demand
Speakers
Martin Olsen
SVP, Products & Solutions, Vertiv
Jim McGregor
CTO and Managing Director, NAM, TIRIAS Research
Stephen Worn
Founder/Principal Analyst, DCD
