Vertiv at Open Compute Project (OCP) Global Summit 2026

October 14, 2026  •  8:25AM–8:50AM  •  San Jose Convention Center, Lower Level, Room LL21DE

PG25 panel

The PG25 Panel brings together representatives from DOW Chemical, AMD, ChemTreat, Microsoft, and Vertiv for a featured discussion at the OCP Global Summit 2026.

October 14, 2026  •  4:10PM–4:25PM  •  San Jose Convention Center, Concourse Level, Expo Hall theater

800 VDC and the AI factory: Grid-to-rack power architectures for MW-scale compute

AI factories introduce dynamic, synchronous, megawatt-scale compute loads. In this session, Scott Armul discusses grid-to-rack power architecture decisions as rack densities move toward 300 kW, 600 kW, and MW-class systems.

The session compares DC power paths, reviews application considerations, and examines potential architectural constraints.

Topics include:

• How 800 VDC changes fault behavior
• Why protection must be addressed at the system architecture level
• How OCP could support standardized interfaces among these systems

October 15, 2026  •  9:10AM–9:30AM  •  San Jose Convention Center, Concourse Level, Room 210CG

Superconducting power distribution for AI data centers: Quantified benefits and open challenges applied to a 250MW reference architecture

This session examines superconducting power distribution for AI data centers using a 250 MW reference architecture. The presenters discuss quantified benefits, design considerations, and open technical challenges associated with applying superconducting power distribution at this scale.

October 15, 2026  •  9:45AM–10:00AM  •  San Jose Convention Center, Lower Level, Room LL21DE

Sustainability and best practices for water efficiency

As AI clusters scale, data center cooling architectures are expanding beyond traditional air-cooled systems to include liquid cooling, immersion cooling, hybrid adiabatic systems, and advanced facility water loops.

Contributors to the OCP water efficiency workstream will discuss emerging practices for water accounting across cooling technologies, facility loops, and regional water conditions.

Topics include:

• Stress-weighted water metrics
• Cooling-loop boundaries
• Water reuse and replenishment strategies
• Embodied water associated with power generation
• Operational resilience
• Normalization across different cooling architectures

October 15, 2026  •  9:45AM–10:10AM  •  San Jose Convention Center, Concourse Level, Room 210CG

OCP modular technology cooling workstream: 2026 update

This session presents updates from the OCP Modular Technology Cooling Systems Workstream as its guidance expands to address AI factory requirements, including increased rack power densities, accelerated deployment schedules, and reliability expectations.

The discussion covers proposed updates to the Modular TCS @ Cloud Scale White Paper, including:

• Modular design and delivery
• 25-micron filtration
• Air removal and degassing
• Fluid performance management
• Thermal resilience
• Off-site pre-commissioning

The session also examines the application of building information modeling (BIM), design for manufacture and assembly methodologies, and standardized modular architectures in digital engineering, project planning, quality management, and scalable deployment.

October 15, 2026  •  3:10PM–3:30PM  •  San Jose Convention Center, Concourse Level, Room 210CG

Commissioning liquid-cooled data centers with computing equipment for operational readiness

As data centers accommodate AI and advanced computing deployments, commissioning practices are evolving to reflect representative operating conditions.

This session examines commissioning with computing equipment as a step following Level 5b performance verification and validation. The presenters discuss how computing loads can provide additional information about infrastructure behavior under representative electrical, thermal, and operational conditions.

The session also considers compute-load commissioning as a complementary, later-stage method for system validation, operational-readiness assessment, and evaluation before production handoff