Vertiv™ Liebert® XDU070 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled environment the Vertiv™ Liebert® XDU070 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU070 operates without facility chilled water and provides an isolated secondary fluid network, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
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- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Vertiv™ Liebert® XDU070 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled environment the Vertiv™ Liebert® XDU070 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU070 operates without facility chilled water and provides an isolated secondary fluid network, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
优点
特性
规格
As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Vertiv XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Vertiv XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.
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