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产品型号

Vertiv™ CoolChip CDU, 600kW

Designed to support liquid cooling within high density environments, the Vertiv™ CoolChip CDU 600kW is suitable for chip & rear door cooling applications to offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU utilizes a liquid-to-liquid heat exchange design, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities while maintaining optimal system conditions.

宣传彩页
主要优点
• Essential separation of the primary (facility) liquid loop, from the secondary (ITE) cooling loop • Deliver exceptional direct-to-chip and RDHx cooling capacity to accommodate high density racks • Improved quality and reliability with redundant pumps, built-in filtration, and unit-to-unit communication capabilities
最适合于:
  • Data Center/Colocation/Hosting
  • Education
  • Government
  • Healthcare
  • Retail and Wholesale

优点

• Achieve incredible efficiency in high-density environments • Protects secondary liquid network with strict confornance to wetted material compatibility • Intuitively designed for ease of deployment • Accomodates any facility design and with multiple cooling configurations • Robust design with confidence inspiring redundancy options including teaming for the most demanding applications • Integrated controller designed from the ground up to be easy and supports leak detection • Flexible support services available for installation and maintenance with same day options

特性

• Compact footprint allows for in-row deployments • Top or bottom liquid supply & return connections • Integrated 50 micron filter • Large 7" responsive color touch screen display • Precise temperature control to eliminate thermal shock for server CPU and GPUs • Intelligent flow monitoring with alarm features • Closed-loop pipe design with integrated leak detection • Easily accessible fill port and drain locations • Innovative Stainless-Steel Designand Hygenic Couplings help ensure Secondary Fluid Network integrity

As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ CoolChip CDU (the next generation of the Liebert® XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. However, and wherever you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power-dense hot spots with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense hot-spots, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.

联系人

支持
显示联系人 California, 91733, USA 更换地点
Vertiv™ Services
+1 800 543 2378
610 Executive Campus Drive Westerville Ohio 43082 USA
产品重点领域: 交流不间断电源(UPS), 配电, 热管理, 一体化解决方案, 机架及模块化机房
Vertiv Academy – Thermal Management Training
+1 844 841 2665
530 Westar Blvd Westerville Ohio 43082 USA
产品重点领域: 热管理

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