Vertiv™ Liebert® XDU070 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled environment the Vertiv™ Liebert® XDU070 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU070 operates without facility chilled water and provides an isolated secondary fluid network, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
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- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
Vertiv™ Liebert® XDU070 Coolant Distribution Unit
Designed to remove barriers to liquid cooling in an air-cooled environment the Vertiv™ Liebert® XDU070 Coolant Distribution Unit is a liquid-to-air heat exchanger for direct to chip cooling applications that offers easy, cost-effective deployment in any data center. The Liebert® XDU070 operates without facility chilled water and provides an isolated secondary fluid network, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities without incurring the costs of major infrastructure changes.
- Data Center/Colocation/Hosting
- Education
- Healthcare
- Government
- Retail and Wholesale
客戶價值
特性
技術規格
As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Vertiv XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Vertiv XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.
- Technical Specifications
- 淨顯熱額定容量 kBtuh [kW]*
- 70.0 kW at 11C approach temperature difference
- 額定氣流資料中心空氣 (CFM, m3/H)
- 10,100 m3/h (5,945 CFM)
- 控制與監控
- Color touch screen display, Communication via Modbus RTU (RS485) and TCP/IP
- 重要元件
- Redundant pump design, variable-speed pump controls, and electronically commutated (EC) fans
- Physical Characteristics
- 重量（磅/公斤）
- 899 lbs
- 重量（磅/公斤）
- 408 kg
- 高度（英寸/毫米）
- 91 in
- 高度（英寸/毫米）
- 2300mm
- 寬度（英寸/毫米）
- 24 in
- 寬度（英寸/毫米）
- 600 mm
- 高度（英寸/毫米）
- 48 in
- 高度（英寸/毫米）
- 1200 mm
- Vertiv™ CoolChip CDU 70 Brochure EN SL-71227
- Vertiv™ CoolChip CDU - Brochure - GL - English
- Vertiv™ CoolChip CDU 70 Data Sheet
- Vertiv™ CoolChip CDU Leak Detection - Data Sheet - English - rev.0326
- Vertiv™ Liquid Cooling Services - Brochure - English
- Vertiv™ Liquid Cooling Services - Data Sheet - English
*查看具體型號產品資料，請進入上方規格表具體型號的產品頁面。
