Vertiv and the Open Compute Project (OCP)
Redefining how AI workloads are powered, cooled, and scaled open, efficient, and ready for tomorrow.
As an active member of the Open Compute Project (OCP), Vertiv collaborates with industry leaders to advance open standards and innovative designs that enhance the efficiency, scalability, and sustainability of modern data centers.
Through its participation in OCP, Vertiv contributes expertise in power, cooling, and IT management systems — helping shape the next generation of infrastructure optimized for high-performance computing and cloud environments.
Why Vertiv for your OCP Project?
Purpose-built with OCP principles
Designed in alignment with Open Compute Project (OCP) principles, these racks, DC power shelves, and cooling units embody efficiency, scalability, and interoperability at every level. With a footprint of 600 x 1,068 mm and a height of 2,236 mm, OCP-validated rack enclosures provide maximum compatibility and efficiency for next-generation data centers. Each rack is purpose-engineered to support advanced power architectures such as 48VDC and 12VDC, providing the flexibility required by modern data center designs. Effective cooling is essential for maintaining performance and energy efficiency in high-density deployments — and we address this with integrated OCP-compliant cooling solutions optimized for thermal management and scalability.
Integrated infrastructure ecosystem
Vertiv provides a complete, integrated ecosystem around the OCP deployment. This includes power distribution, monitoring, cooling, and management — all designed to work seamlessly together. Our power systems include OCP-compliant busways, power shelves, and rectifiers. Intelligent monitoring and management tools such as serial consoles, provide full visibility and control of the physical and IT infrastructure. Through pre-integration and factory testing, we deliver solutions that are ready to deploy and easy to scale, whether at the edge or in large data centers.
Efficiency, cooling, and future-readiness
As data centers move toward higher densities, cooling becomes an even more critical part of the solution. Vertiv provides multiple cooling options designed to work efficiently with OCP deployments, including air-cooled rack- and row-based solutions, coolant distribution units (CDUs), rear door heat exchangers, and in-rack liquid manifolds. Vertiv's collaboration with industry partners on projects, such as Google's Project Deschutes CDU, demonstrates our expertise in liquid cooled systems, offering open standards for data center facility designers and enabling broader liquid cooling adoption while balancing performance, reliability, and energy efficiency.
Proven global experience and support
Vertiv supports some of the largest data center and cloud operations in the world, offering consistent quality and service in over 130 countries. Our global manufacturing and service presence ensures reliable delivery, spare parts availability, and 24/7 technical support. Vertiv’s project management teams handle every stage — from design and build to deployment and maintenance — enables your OCP deployment roll-out is smooth, standardized, and supported wherever you operate.
Where OCP innovation meets Vertiv engineering solutions
Engineered for OCP compliant AI infrastructure
Open, scalable, and efficient.
Vertiv’s OCP ORv3 rack solutions deliver standardized, high-efficiency power and cooling architectures that accelerate deployment and simplify integration across open compute environments.
Ideal for: cloud, enterprise, and colocation workloads built on OCP standards.
Vertiv and NVIDIA: AI-ready reference architecture
Purpose-built for accelerated computing.
Our MGX rack platform supports NVIDIA NVL72, and RTX servers with integrated liquid cooling, DC power distribution, and high-density design — enabling performance, reliability, and rapid deployment for AI and HPC clusters.
Ideal for: NVIDIA GBx00 SuperPODs, AI training, and inference workloads.
Complete power, cooling, and services for AI
Retrofit legacy infrastructure with AI-ready systems.
Vertiv™ 360AI retrofit designs include a comprehensive portfolio of retrofit-ready IT infrastructure solutions – including racks, power, cooling, and services—designed to help data centers seamleassly integrate high-density AI computing. Your answer to easy to transition to AI-ready infrastructure.
Ideal for: Finance/Insurance, Healthcare, Industrial & Manufacturing, Government, Higher education, Colocation Data Centers
Maximizing whitespace with OCP components
Vertiv™ PowerDirect 3000 33kW for NVIDIA GB300 platform
A high-density 50V DC power shelf designed for GB300 NVL72 platforms, with a compatible configuration available for GB200 NVL72, delivering efficient, scalable rack-level power for AI infrastructure.
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OCP racks
The MGX and ORV3 racks are high-density, scalable platforms designed for modern AI workloads and open compute environments.
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Vertiv™ PowerDirect In-Rack 33kW 50V DC Power System
A high-density, scalable DC power system designed for modern data centers and open compute ORV3 environments.
Vertiv™ CoolChip CDU 121
It’s an in-rack coolant distribution unit designed to support single-rack direct-to-chip applications.
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Vertiv CoolChip CDU - Project Deschutes 5
Vertiv™ CoolChip CDU for open standards is built to Google's Project Deschutes 5th-generation OCP specification delivering up to 2MW cooling capacity and enabling high-density computing through flexible deployment options.
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References
Vertiv has been a powerful voice in the Open Compute Project, contributing to product development, serving on multiple OCP committees, co-authoring several papers, and presenting on various topics at Open Compute events.
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