Ideas collide, prototypes evolve, and engineers learn faster than any algorithm. How does the Vertiv Technology Fair turn collaboration into AI breakthroughs?
At the International Thermonuclear Experimental Reactor (ITER) in France, they’re doing something the world has never done: containing plasma hotter than the sun to generate energy in ways never attempted before. Thousands of engineers and scientists from dozens of countries coordinate across physics, materials, and energy systems. Every component pushes the limits of what’s possible. By collaborating, iterating, and solving problems together, they’re turning a bold vision into a working reality.
As I prepare for the Vertiv Technology Fair (or Tech Fair), I’ve been thinking about ITER and the impact of gathering technologists in one room. Tackling unprecedented artificial intelligence (AI) infrastructure challenges requires the same approach: bringing diverse expertise together, sharing insights, iterating fast, and collaborating across disciplines to solve problems that no single team could manage alone.
Collaboration that bridges silos
The Vertiv Tech Fair began as a simple cafeteria huddle. A few engineers shared notes, brainstormed designs, and left with better solutions. That small exchange evolved into a global platform where engineers, partners, and customers collaborate to shape the next generation of critical infrastructure. The Fair connects innovators across regions and companies—both infrastructure and silicon—so they can align, iterate, and accelerate progress. By linking teams to the the Chief Technology Officer's (or the CTO's) vision, it sparks innovation, helping engineers tackle local challenges and seize new opportunities.
Tech summit networks that drive impact
Jana Subrahmanyam (see Figure 1) experienced this firsthand when he started his role in Ohio. The Tech Fair gave him access to the global engineering network. “The event allowed everyone to put faces to names, which wasn’t easy before. Meeting in person helped overcome language and cultural differences and enabled faster advancement,” he recalls.
Figure 1. Jana Subrahmanyam, Senior Director of Engineering Management for Product Development/Engineering at the Vertiv Technology Fair 2024, leading the rapid-fire sessions.
For Utkarsh Charapale in Pune, the Fair had a similar effect. Early in his career, most engineers had only a limited view of the CTO’s agenda. Presenting initiatives at the Fair put him on colleagues’ radar. Engineers began reaching out for project guidance, brainstorming, and academic partnerships—connections that continue to shape his work today.
Enhancing talents, advancing technology
Behind every technical leap are engineers given room to be heard. Jana noted how much that matters: “Colleagues recognize innovation, which inspires more people to follow the innovation path. The biggest challenge for engineers is speaking out their ideas, and the event created an environment where they feel comfortable doing so.” (see Figure 2)
Figure 2. Interns at the Tech Fair help run sessions, manage logistics, and support discussions with technology partners, giving them direct experience in innovation and collaboration.
That environment opened multiple paths forward, as it did for Utkarsh. He joined Vertiv in Pune straight out of school and filed his first patent within three months. He cites his first Tech Fair, then called the Innovation Summit, as the moment when early ideas moved from his notebook into open debate with senior engineers and peers. Those exchanges refined his thinking, pushed him to innovate at a higher level, and gave him a role in shaping the platform itself (see Figure 3). Empowering talent in this way creates a cycle where new ideas surface faster and solutions scale across the organization.
Figure 3. Utkarsh Charapale, Technology Innovation Manager for Product Development/Engineering presenting the tech scouting process during one of the panel discussions at the Vertiv™ Technology Fair 2024.
From collaboration to measurable outcomes
Cross-disciplinary discussions at the Fair can turn concepts into intellectual property at a scale isolated teams rarely achieve. Jana pointed out some clear results, saying, “For the first time, I saw a significant increase in patent applications at the Vertiv Pune office.” Patent filings surged as engineers moved ideas from discussion to actionable designs. Ideas debated across teams quickly translated into protectable designs.
“Our Technology Fair has become a cornerstone of global collaboration, bringing together engineering talent from across regions to share insights, align on challenges, and spark innovation. The cross-functional dialogue and problem-solving that occur during these events have directly led to a notable increase in patentable ideas. It’s a clear example of how intentional collaboration across borders drives meaningful IP generation and strengthens our innovation pipeline. ”
Vertiv’s General Counsel for Global IP
The Tech Fair addresses today’s challenges while anticipating tomorrow’s. AI workloads are growing faster than infrastructure cycles, demanding tighter collaboration and quicker iteration.
Gearing up for the next breakthrough
The Vertiv Tech Fair turns collaboration into action, connecting engineers across regions to refine ideas, tackle complex challenges, and generate innovations that influence real-world deployments. By aligning expertise and sharing knowledge, the event accelerates progress on the infrastructure powering AI and high-density computing.
So, just as ITER turned an audacious vision into reality through global collaboration, the breakthroughs in AI infrastructure we’re pursuing at the Tech Fair will come from engineers and teams coming together, sharing ideas, and solving unprecedented challenges side by side.
