AI Solutions
Innovation Roadshow

: Vertiv AI Solutions Innovation Roadshow; 2025/01/28 15:00; 2025/01/27 23:00
: 1月 28日 - 一月 27, 2025

Connect with our power and cooling experts at the Vertiv AI Innovation Roadshow. Get insights on the effects of accelerated IT and high-performance computing (HPC) on data centers, the challenges and opportunities, and what the journey to higher density could mean for your deployments.

Discover AI-ready solutions from Vertiv in several cities across North America. Our first stop will be at Westerville, OH, on Wednesday, April 10; explore the complete list of cities to find a stop near you.

Register today to learn how Vertiv’s comprehensive AI-ready portfolio powers and cools even the highest-density workloads in the most challenging deployments.

Thank You for Joining Us!

The AI Solutions Innovation Roadshow has successfully concluded its 13 stops across the United States. We want to extend our heartfelt thanks to everyone who participated and made it a success.

While the AI Solutions Innovation Roadshow has come to a successful end, the journey continues! We are excited to announce that the roadshow will resume in Q3 with even more exciting insights and innovations. We look forward to your continued participation and can't wait to see you there!

Keep an eye on this page and our social media channels for updates and future announcements.

Invigorating discussions for AI deep-dive will equip you with information that will help you plan your high-density journey.

Power chain session topics

Power sourcing and distribution from grid to rack
Optimizing your energy storage deployment
Defining best-practices in energy storage technology and applications
Efficient and sustainable power architecture design

Thermal chain session topics

Traditional data centers cooling technologies
Transitioning traditional data centers to support AI
Building greenfield AI-ready datacenters

Only Vertiv can meet the power and cooling needs of your AI workloads

Vertiv has the technological expertise, portfolio breadth, services capabilities, operational footprint and industry partnerships to power and cool your HPC deployments. Join us to learn more about the solutions that will make your operations AI-ready.

Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

Technical partnerships with chipmakers leading the AI revolution.

End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

Services coverage with unmatched global reach and AI-ready capability.

Resilient manufacturing footprint able to scale up new technologies globally.

Unique pre-fabricated modular offering from single rack to entire data center.

Most advanced and complete portfolio in IT power and cooling infrastructure in the industry.

Technical partnerships with chipmakers leading the AI revolution.

End-to-end solutions taking power from grid to chip, and rejecting heat from chip to outside the data center.

Services coverage with unmatched global reach and AI-ready capability.

Resilient manufacturing footprint able to scale up new technologies globally.

Unique pre-fabricated modular offering from a single rack to the entire data center.

Key drivers of growth

The development of the newest AI servers is driving heat loads to reach 6 kW to 10 kW per server. And chip, server, and rack heat densities are only continuing to rise.

Explore when to adopt Liquid Cooling for rising rack densities